【轉貼網址】 http://www.techpowerup.com/61716/Intel_Nehalem_Bloomsfield_CPU...-up_Before_Computex_2008.html來源
http://www.bit-tech.net/news/2008/05/30/...ow-up-in-taipei/1Intel Nehalem, Bloomsfield CPU and Tylersberg Chipset Close-up Before Computex 2008
When it comes to hot news from MSI, my favourite source has always been bit-tech.net. These guys have some very good connections with MSI. Now a week before Computex 2008, they have convinced MSI to let them get a close-up look at Intel's next generation Nehalem architecture, which is based on the Bloomsfield CPU platform and Tylersberg chipset also known under the X58 nomenclature. The following pictures show a 1366-pin quad-core Bloomsfield CPU (no model and specs for now) with HT support and integrated DDR3 memory controller. All Bloomsfield processors will require a new cooling. Regular LGA775 coolers won't fit. The Tylersberg X58 motherboard made by MSI has six DDR3 memory slots. Six becuase you'll need a minimum of three DDR3 DIMMs to run in triple-channel mode. The chipset also features 36 lanes of PCI-Express 2.0, so you’ll get a full x16 by x16 for at least two video card slots. The south bridge used with Tylersber is still ICH10, so don't expect extraordinary features when it comes to the number of SATA or USB 2.0 ports. Check out the rest of the pictures by the author Richard Swinburne over at bit-tech.net
稍微說明一下
也就是目前LGA775改成LGA1366
新的CPU將內建記憶體控制器，就像像在AMD一樣
全部Bloomsfield 處理器將需要一新冷卻。
一般的LGA775 冷卻器將不適合。
支援DDR3 3通道
PCIE為2.0
南橋仍然是ICH10
姑且不論效能以目前DDR3價格那麼高，加上目前Core2效能已經很足夠一般消費者使用
而且對手又處於疲弱狀態，新的規格出來又要經過一番大淘汰，相信大部人是不會更換的
所以看看就好～～
